Yamaha Flip Chip Bonder Hybrid Placer YSB55w

High-Accuracy ±5?m
High-Quality & Flexibility
Weight:3,600kg
simultaneous transfer :13,000 UPH

Yamaha Flip Chip Bonder Hybrid Placer YSB55w

Specifications:

Yamaha Flip Chip Bonder Hybrid Placer YSB55w

YSB55w, a high-speed, high-accuracy flip-chip*1 bonder that achieves industry-leading productivity and high-accuracy bonding. This model will be released in December 2015.

The new YSB55w is a flip-chip bonder specially designed to bond flip-chips onto printed circuit boards, etc., with the flip-chips that are used in IT communications devices and digital appliances being manufactured in increasing numbers. It features a high-rigidity frame and dual bonding heads, and is fitted with a flip-chip recognition system employing a high-resolution camera. Developed to cater to a market increasingly focused on mass-production, Yamaha has realized the high accuracy demanded of the latest leading-edge flip-chips, almost tripling the bonding capacity of existing Yamaha models at 13,000 UPH*2 for flip-chips from wafer supply (under optimal conditions, includes processing time), and doubling the bonding accuracy at ±5um (3sigma).

1.Flip-chip: A type of semi-conductor integrated circuit (chip) that enables more compact and functionally-enhanced semi-conductor devices.

2.UPH (Units Per Hour): Total number of chips that can be bonded in one hour. Yamaha's existing model, the YSH20, operates at 4,500 UPH

Background to Development

Yamaha already has a track record of successfully applying its surface mount technology to the development and manufacture of bonders compatible with flip-chip and other semi-conductor packaging, and has a good reputation for superior bonding accuracy and versatility.

However, growth in the market and production scale for smartphones and wearable devices in recent years has seen even greater penetration of flip-chips, as they meet the more detailed process rules required to make the device modules used in these products smaller, thinner, more energy efficient and functionally superior. This uptake of flip-chips has in turn generated demand for greater bonding accuracy and productivity.

In order to respond to this kind of market demand, Yamaha has loaded the YSB55w with its latest technology and accumulated knowhow, to achieve almost triple the productivity and double the high-precision bonding accuracy of existing models. With the YSB55w, Yamaha aims to strengthen its position in the semiconductor manufacturing equipment industry.

Product Features

High-speed/High-accuracy

Realizing high-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process

Model name

YSB55w

Applicable PCB

L260 × W200 - L50 × W50mm

PBC thickness

0.2 - 3.0mm

PBC transport direction

Left to right (Option: right to left)

Bonding capability

13,000 UPH (under optimal conditions, includes processing time)

Bonding accuracy

±5?m (3?) (Guaranteed accuracy when using Yamaha standard components)

Component supply configuration

12 inch wafers

External dimensions

L2,090 × D1,866 × H1,550mm

Weight

Approx. 3,500kg

Keywords:

JUKI RS-1R Pick and Place MachineJUKI RX-7R Pick and Place MachineJUKI RX-8 Pick and Place MachineJUKI RS-1R SMT Assembly LineJUKI RX-7R SMT Assembly LineJUKI RX-8 SMT Assembly Line.

We provide JUKI SMT assembly line solutions, including JUKI Assembly Line Equipments JUKI productsJUKI Pick and Place Machine MachineJUKI SMT Stencil PrinterJUKI Assembly LineJUKI SMT Reflow OvenJUKI SMT Inspection MachineJUKI SMT Spare PartsSMT EquipmentJUKI SMT Peripheral Equipment;  any kind SMT equipments you may need, please contact us for more information: wechat whatsapp:+8613691605420, Email: sales@flason-smt.com
1) This is the first time I use this kind of machine, is it easy to operate?
There is English manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail/skype/phone/wechat online service.
2) If machine have any problem after I receive it, how can I do ?
Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
3) MOQ ?
1 set machine, mixed order is also welcomed.
4) How can I buy this machine from you? ( Very easy and flexible !)
A. Consult us about this product on line or by e-mail.
B. Negotiate and confirm the final price , shipping , payment methods and other terms.
C. Send you the proforma invoice and confirm your order.
D. Make the payment according to the method put on proforma invoice.
E. We prepare for your order in terms of the proforma invoice after confirming your full payment And 100% quality check before shipping.
F.Send your order by air or by sea.
5)Why choose us ?
A. We have customer world wide, you can check our credit service with them !
B. Free Online installation, traning, programming and technical support !
C. One stop full Through Hole Assembly Line Equipments Solutions !

INQUIRY

CATEGORIES

CONTACT US

Contact: Tommy

Phone: +86 13691605420

E-mail: sales@flason-smt.com

Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China