Min component: 01005
PCB size:350x330mm
Dimension:1000x1335x1627mm
weight:600kg
Koh Young KY8080 3D SPI
Specifications:


The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste.
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best
• Lower initial investment
• Low cost of ownership, fast ROI
• Shortest programming time
• Accurate, powerful SPC tool package
In-line SPI with no compromises KY-8030 is designed for manufacturers who need in-line SPI with no compromises in high precision and accuracy. With KY-8030, you buy the throughput capability that you need
KY-8030 is a process optimization tool built with world-class Koh Young quality components and engineering. It’s the perfect complement to your manufacturing line, where precise, accurate, repeatable results cannot be compromised. The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. Superb Performance and Value in Automated 3D SPI
Medium-volume users will appreciate KY-8030’s rugged dependability and all the benefits of in-line 3D SPI but at a lower initial investment. It delivers superior value to the customer because it will out-perform costly competitive systems that don’t offer true 3D SPI.
| Inspection Range | |
| Metrology Capability | Volume, Area, Height, Offset, Bridging and Shape Deformity | 
| Types of Defects | Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset | 
| Measurement Principle | 3D Shadow Free Moiré | 
| Camera Technology | |
| Camera | 2MPix | 
| XY Pixel Resolution: 20 µm 0.79 mils | |
| Z Resolution: 0.37 µm 0.015 mils | |
| Inspection Speed at 20 um | Shadow Free Mode:15.0 cm2/sec 2.33 sq. inch/sec | 
| High Speed Mode: 19.7 cm2/sec 3.05 sq. inch/sec | |
| Volume Repeatability | < 1% at 3sigma (on a KY Calibration Target) | 
| < 3% at 3sigma (on a PCB) | |
| Height Accuracy | 2mm | 
| Gage R&R | < 10 % at 6Sigma (± 50 tolerance) | 
| Max. PCB Warp | ± 3.5 mm | 
| Max. Paste Height | 400um 15.75 mils | 
| Min. Paste Deposit Size at 20um | Rectangle: 150um 5.91 mils | 
| Circle Min: 200um 7.87 mils | |
| Distance between Paste Deposit | 100 mm (at 150 mm paste height) 3.94 mils (at 5.91 mils paste height) | 
| PCB Handling | |
| Conveyor Width Adjustment | Automatic | 
| Conveyor Fix Type | Front/Rear Fixed (Factory Setting) | 
| Conveyor Height | 970 ~ 870 mm 38.19 ~ 34.25 inch | 
| System & Installation requirements | |
| Supply | Electrical 200 ~ 240VAC, 50/60 Hz Single phase | 
| Air: 5 Kgf/cm2 | |
| Operating System | Windows XP Professiona | 
| S/W | |
| Statistical Analysis Tool | SPC Plus | 
| Inspection Program Generation | Import GERBER Data (274X, 274D) | 
| Options | Zoom Head (15, 20, 30 mm Autozoom) | 
| Off-line SPC & Defect Review Station | |
| Off-line Programming Station ODB++ File Conversion | |
| Barcode Reader (1D/2D) HDD Raid 1 (Mirrored) | |
| Certified Calibration Target UPS | |
| Above specifications are subject to change whithout notice. | |
Keywords:
JUKI RS-1R Pick and Place Machine, JUKI RX-7R Pick and Place Machine, JUKI RX-8 Pick and Place Machine, JUKI RS-1R SMT Assembly Line, JUKI RX-7R SMT Assembly Line, JUKI RX-8 SMT Assembly Line.




Contact: Tommy
Phone: +86 13691605420
E-mail: tommy@flason-smt.com
Add: No.94,Guangtian Road,Songgang Street,Bao an District Shenzhen China